Electronic device module, method of manufacturing the same and electronic apparatus

ABSTRACT

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/731,282 filed on Dec. 31, 2019, now U.S. Pat. No. 11,209,872 issuedon Dec. 28, 2021, which is a continuation of U.S. patent applicationSer. No. 16/181,485 filed on Nov. 6, 2018, now U.S. Pat. No. 10,564,679issued on Feb. 18, 2020, which claims the benefit under 35 USC 119(a) ofKorean Patent Application No. 10-2018-0039595 filed on Apr. 5, 2018, andKorean Patent Application No. 10-2018-0065419 filed on Jun. 7, 2018, inthe Korean Intellectual Property Office, the entire disclosures of whichare incorporated herein by reference for all purposes.

BACKGROUND 1. Field

The following description relates to an electronic device module and amethod of manufacturing an electronic device. For example, the followingdescription is related to an electronic device module in which a passivecomponent, a semiconductor chip, or the like, included in a module, maybe protected from an external environment while electromagnetic wavesare blocked, and a method of manufacturing such an electronic device.

2. Description of Related Art

In the electronic products market, consumption of portable electronicproducts has increased rapidly, and there has accordingly been demandfor small, lightweight electronic components to be provided in portableelectronic product systems.

To meet such a demand, it has been necessary to use a technique forreducing the sizes of individual components, and also, a system-on-chip(SOC) technique that integrates individual components into a singlechip, or a system-in-package (SIP) technique that integrates individualcomponents into a single package.

Particularly, in the case of a high frequency electronic device moduleusing a high frequency signal, such as a communications module or anetwork module, it has been necessary to provide electromagnetic waveshielding structures having various forms to successfully implementshielding properties in relation to electromagnetic wave interference,along with miniaturization.

SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

In one general aspect, an electronic device module includes a substrate,a first component disposed on a first surface of the substrate, asealing portion disposed on the first surface of the substrate, a secondcomponent disposed on the first surface of the substrate and embedded inthe sealing portion, and a shielding wall at least partially disposedbetween the first component and the second component and including aportion having a height, with respect to the first surface of thesubstrate, that is lower than a height of the sealing portion.

The shielding wall and the first component may be spaced apart, and thesealing portion may be disposed between the shielding wall and thesecond component.

The shielding wall may be a square ring, and the first component may bedisposed in an internal space defined by the shielding wall.

The shielding wall may include two walls connected to each other, and atleast one of the two walls may be disposed between the first componentand the second component.

The shielding wall may extend across an entire width of the firstsurface of the substrate.

The substrate may include a ground electrode, and the shielding wall maybe bonded to the ground electrode.

A shielding layer may be disposed along a surface of the sealingportion.

The shielding layer may be connected to an upper end of the shieldingwall.

The shielding layer and the shielding wall may be formed of differentmaterials.

The sealing portion may include a first sealing portion without theshielding layer and connected to the shielding wall, a second sealingportion provided with the shielding layer, and a third sealing portionwithout the shielding layer and having a thickness, with respect to thefirst surface of the substrate, that is less than a thickness of thefirst sealing portion and a thickness of the second sealing portion. Anantenna may be disposed on or in a portion of the substrate thatoverlaps the third sealing portion.

In another general aspect, a method of manufacturing an electronicdevice module includes mounting a first component and a second componenton a first surface of a substrate, mounting a shielding case formed of aconductive material and defining a receiving space on the first surfaceof the substrate so that the first component is accommodated in thereceiving space, disposing a sealing portion sealing the secondcomponent and the shielding case on the first surface of the substrate;and exposing the receiving space to the outside of the sealing portionby partially removing the sealing portion and the shielding case.

The method may include forming a shielding layer on a surface of thesealing portion before exposing the receiving space to the outside ofthe sealing portion.

Forming the shielding layer may include partially exposing the shieldingcase by partially removing the sealing portion, and disposing theshielding layer on a surface of the sealing portion and the partiallyexposed shielding case.

Partially exposing the shielding case may be performed by removing anupper surface of the sealing portion using a grinder until the shieldingcase is exposed.

Partially exposing the shielding case may be performed by exposing onlya portion of the shielding case that corresponds to a wall disposedbetween the first component and the second component using a blade or alaser.

Exposing the receiving space to the outside of the sealing portion mayinclude partially removing the sealing portion and the shielding caseusing a grinder.

In another general aspect, an apparatus includes an electronic devicemodule that includes a substrate, a first component disposed on a firstsurface of the substrate, a sealing portion disposed on the firstsurface of the substrate, a second component disposed on the firstsurface of the substrate and embedded in the sealing portion, ashielding structure at least partially disposed between the firstcomponent and the second component, and an antenna disposed on a secondsurface of the substrate or inside the substrate at a position thatoverlaps the first component.

The shielding structure may include a first wall disposed between thefirst component and the second component.

The first wall may have a height above the first surface of thesubstrate that is shorter than a height of the sealing portion.

The shielding structure may include a second wall, the first wall mayhave a height above the first surface of the substrate that is equal toa height of the sealing portion, and the second wall may have a heightabove the first surface of the substrate that is shorter than the heightof the sealing portion.

Other features and aspects will be apparent from the following detaileddescription, the drawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view of an electronic device moduleaccording to an example.

FIG. 2 is a top view of the electronic device module illustrated in FIG.1.

FIGS. 3 to 6 are views illustrating processes in a method ofmanufacturing an electronic device module.

FIGS. 7 to 9 are top views of an electronic device module according toan example.

FIG. 10 is a cross-sectional view of an electronic device moduleaccording to an example.

FIGS. 11 to 13 are views illustrating a method of manufacturing theelectronic device module illustrated in FIG. 10.

FIG. 14 is a cross-sectional view of an electronic device moduleaccording to an example.

FIGS. 15 to 17 are views illustrating a method of manufacturing theelectronic device module illustrated in FIG. 14.

FIG. 18 is a top view of an electronic device module according to anexample.

FIG. 19 is a cross-sectional view taken along line I-I′ in FIG. 18.

Throughout the drawings and the detailed description, the same referencenumerals refer to the same elements. The drawings may not be to scale,and the relative size, proportions, and depiction of elements in thedrawings may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

The following detailed description is provided to assist the reader ingaining a comprehensive understanding of the methods, apparatuses,and/or systems described herein. However, various changes,modifications, and equivalents of the methods, apparatuses, and/orsystems described herein will be apparent after an understanding of thedisclosure of this application. For example, the sequences of operationsdescribed herein are merely examples, and are not limited to those setforth herein, but may be changed as will be apparent after anunderstanding of the disclosure of this application, with the exceptionof operations necessarily occurring in a certain order. Also,descriptions of features that are known in the art may be omitted forincreased clarity and conciseness.

The features described herein may be embodied in different forms, andare not to be construed as being limited to the examples describedherein. Rather, the examples described herein have been provided merelyto illustrate some of the many possible ways of implementing themethods, apparatuses, and/or systems described herein that will beapparent after an understanding of the disclosure of this application.

Herein, it is noted that use of the term “may” with respect to anexample or embodiment, e.g., as to what an example or embodiment mayinclude or implement, means that at least one example or embodimentexists in which such a feature is included or implemented while allexamples and embodiments are not limited thereto.

Throughout the specification, when an element, such as a layer, region,or substrate, is described as being “on,” “connected to,” or “coupledto” another element, it may be directly “on,” “connected to,” or“coupled to” the other element, or there may be one or more otherelements intervening therebetween. In contrast, when an element isdescribed as being “directly on,” “directly connected to,” or “directlycoupled to” another element, there can be no other elements interveningtherebetween.

As used herein, the term “and/or” includes any one and any combinationof any two or more of the associated listed items.

Although terms such as “first,” “second,” and “third” may be used hereinto describe various members, components, regions, layers, or sections,these members, components, regions, layers, or sections are not to belimited by these terms. Rather, these terms are only used to distinguishone member, component, region, layer, or section from another member,component, region, layer, or section. Thus, a first member, component,region, layer, or section referred to in examples described herein mayalso be referred to as a second member, component, region, layer, orsection without departing from the teachings of the examples.

Spatially relative terms such as “above,” “upper,” “below,” and “lower”may be used herein for ease of description to describe one element'srelationship to another element as shown in the figures. Such spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,an element described as being “above” or “upper” relative to anotherelement will then be “below” or “lower” relative to the other element.Thus, the term “above” encompasses both the above and below orientationsdepending on the spatial orientation of the device. The device may alsobe oriented in other ways (for example, rotated 90 degrees or at otherorientations), and the spatially relative terms used herein are to beinterpreted accordingly.

The terminology used herein is for describing various examples only, andis not to be used to limit the disclosure. The articles “a,” “an,” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. The terms “comprises,” “includes,”and “has” specify the presence of stated features, numbers, operations,members, elements, and/or combinations thereof, but do not preclude thepresence or addition of one or more other features, numbers, operations,members, elements, and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, variations of theshapes shown in the drawings may occur. Thus, the examples describedherein are not limited to the specific shapes shown in the drawings, butinclude changes in shape that occur during manufacturing.

The features of the examples described herein may be combined in variousways as will be apparent after an understanding of the disclosure ofthis application. Further, although the examples described herein have avariety of configurations, other configurations are possible as will beapparent after an understanding of the disclosure of this application.

FIG. 1 is a cross-sectional view of an electronic device moduleaccording to an example. FIG. 2 is a top view of the electronic devicemodule in FIG. 1.

Referring to FIGS. 1 and 2, an electronic device module 100 may includea substrate 11, electronic components 1, a sealing portion 14, and ashielding wall 15.

On a first surface of the substrate 11, electrodes for mounting theelectronic components 1, a ground electrode 19, and, although notillustrated, a wiring pattern in which the electrodes for mounting theelectronic components 1 are electrically connected to each other, may beformed.

The at least one electronic component 1 may be mounted on the electrodefor mounting the electronic components 1.

The ground electrode 19 may be electrically connected to the shieldingwall 15.

The ground electrode 19 may be disposed only between a first component 1a and a second component 1 b and connected to the shielding wall 15.However, the disclosure is not limited to such a configuration. Theground electrode 19 may be configured to be formed along an overallshape of the shielding wall 15, and be connected to an overall area ofthe shielding wall 15, or other various modifications may be possible.

The ground electrode 19 may be formed in solid line form, but is notlimited to such a configuration. The ground electrode 19 may havevarious forms as long as the ground electrode 19 is able to be connectedto the shielding wall 15. For example, the ground electrode 19 may beformed a broken line or a dotted line.

Although not illustrated in detail, the electrode for mounting theelectrode component 1 or the ground electrode 19 may be protected byprotective insulation layers (not illustrated) disposed in layers on anupper portion of the substrate 11, and may be exposed externally throughan opening formed in the protective insulation layer. As the protectiveinsulation layer, a solder resist may be used, but the protectiveinsulation layer is not limited to such a configuration.

As the substrate 11, various types of circuit substrates (e.g., aceramic substrate, a printing circuit substrate, a flexible substrate,and the like) generally used in the respective technical field may beused. The substrate 11 may be a multilayer substrate 11 having aplurality of layers, and a circuit pattern may be formed between thelayers.

An antenna wiring may be formed on a second surface, such as a lowersurface, of the substrate 11, or inside the substrate 11.

The electronic components 1 may include a variety of electronic devicessuch as a passive device and an active device. The electronic components1 may be electronic components able to be mounted on or in the substrate11. The electronic components are not limited to such devices, but mayalso include various components such as a connector.

The electronic components 1 may include at least one second component 1b embedded in the sealing portion 14, and at least one first component 1a disposed on the outside of the sealing portion 14, and not embedded inthe sealing portion. For example, the first component 1 a may be aconnector, and the second component 1 b may be an electronic device, butthe electronic components 1 are not limited to such a configuration.

The sealing portion 14 may be disposed in the first surface of thesubstrate 11, and may seal one or more of the electronic components 1,such as the second component 1 b. The sealing portion 14 may fix theelectronic components 1 by sealing the component externally, therebyprotecting the electronic components 1 safely from an external impact.The first component 1 a may be disposed on the outside of the sealingportion 14, without being embedded in the sealing portion 14.

The sealing portion 14 may be formed of an insulation material. Forexample, the sealing 14 may be formed of a resin material such as anepoxy molding compound (EMC), but is not limited to such a material. Thesealing portion 14 may be formed of a conductive material (e.g., aconductive resin, and the like). An individual sealing portion, such asan underfill resin, may be provided between the second component 1 b andthe substrate 11.

The shielding wall 15 may be disposed between the sealing portion 14 andthe first component 1 a, and block electromagnetic waves flowing intothe second component 1 b from the first component 1 a or flowing intothe first component 1 a from the second component 1 b. The shieldingwall 15 may be formed of a conductive material, and electricallyconnected to the ground electrode 19 on the substrate 11. For example,the shielding wall 15 may be a metal plate, and may be bonded to theground electrode 19 on the substrate 11 by a conductive adhesive agentsuch as a solder or a conductive resin.

The shielding wall 15 may be formed to have a shape of a square ringcompletely sealing the first component 1 a, and an internal area of theshielding wall 15 may be formed to have a shape of an empty pipe.

The shielding wall 15 may prevent a material (e.g., a molding resin) ofthe sealing portion 14 from flowing into the first component 1 a whenthe sealing portion 14 is formed in the process of manufacturing theelectronic device module. The first component 1 a may not be embedded inthe sealing portion 14 due to the shielding wall 15.

The shielding wall 15 may be formed to have a shape of a square ring.However, the shape of the shielding wall is not limited to such a shape.The shielding wall 15 may have various forms as long as a flow ofelectromagnetic waves is able to be shielded between the first component1 a and the second component 1 b. For example, the shielding wall 15 maybe formed to have a shape of a circular ring, an oval ring, a polygonalring, or the like.

A mounting height of the shielding wall 15 may be configured to be equalto or higher than a height of the first component 1 a.

A mounting height of the shielding wall 15 may be configured to be lowerthan a height of the sealing portion 14. The shielding wall 15 may beformed using a shielding case 15 a (in FIG. 4). A process of partiallyremoving the shielding case 15 a may need to be performed, and amounting height of the shielding wall 15 may be configured to be lowerthan a height of the sealing portion 14.

However, as in the example of FIG. 14, a height of a portion of theshielding wall 15 may be configured to be equal to a height of thesealing portion 14. However, a height of the other portion of theshielding wall 15 may be configured to be lower than the height of thesealing portion 14.

A mounting height of a portion of the shielding wall 15 may beconfigured to be lower than a height of the sealing portion 14.

A method of manufacturing an electronic device module according to anexample will be described below.

FIGS. 3 to 6 are views illustrating processes in a method ofmanufacturing an electronic device module.

As illustrated in FIG. 3, the electronic components 1 may be mounted ona first surface of the substrate 11.

The substrate 11 may be a multilayer circuit substrate 11 having aplurality of layers, and an electrically connected circuit pattern maybe formed between the layers.

The electronic components 1 may be bonded to the substrate 11 through aconductive adhesive agent such as a solder.

A shielding case 15 a may be mounted on the first surface of thesubstrate 11 as illustrated in FIG. 4.

The shielding case 15 a may be formed of a conductive material, and maybe formed in a form of a container of which one surface is opened, and areceiving space may be provided therein.

The shielding case 15 a may be formed to have a shape of a rectangularparallelepiped of which one surface is opened. However, the shape of theshielding case 15 a is not limited to such a shape. The shielding case15 a may have various forms as long as a receiving space in which thefirst component 1 a is able to be placed is provided in the shieldingcase 15 a. For example, the shielding case 15 a may be formed to have ashape of a cylinder, a polygon column, or the like.

The shielding case 15 a may be mounted on the substrate 11 such that thefirst component 1 a is placed in the internal receiving space. Theopened surface of the shielding case 15 a may be bonded to the firstsurface of the substrate 11. At least a portion of the shielding case 15a may be connected to the ground electrode 19.

In the example, the electronic components 1 are mounted on the substrate11, and then the shielding case 15 a is mounted on the substrate 11.However, the disclosure is not limited to such a process.

For example, after a conductive paste is coated to the substrate 11, theelectronic components 1 and the shielding case 15 a may be disposed onthe conductive paste, and the electronic components 1 and the shieldingcase 15 a may be bonded to the substrate 11 at the same time through areflow soldering process.

As illustrated in FIG. 5, the sealing portion 14 may be formed on thefirst surface of the substrate 11 by sealing the electronic components1.

The sealing portion 14 may be formed on an overall area of the firstsurface of the substrate 11. The sealing portion 14 may be formed suchthat one or more of the electronic components 1, including the secondcomponent 1 b, and also the shielding case 15 a covering the firstcomponent 1 a may be embedded in the sealing portion 14.

A material (e.g., a molding resin) forming the sealing portion 14 maynot be flowed into the internal space of the shielding case 15 a becauseof the shielding case 15 a. Thus, the first component 1 a may not be incontact with the material forming the sealing portion 14.

The sealing portion 14 may be formed by a transfer molding method, butthe disclosure is not limited to such a method.

As illustrated in FIG. 6, the sealing portion 14 and the shielding case15 a may be partially removed. The removed portion may be a first areaA1 (in FIG. 1) in which the shielding case 15 a is disposed, while asecond area A2 (in FIG. 1) in which the second component 1 b is disposedmay not be removed.

The sealing portion 14 may be removed by reducing a thickness of thesealing portion 14. A grinder “G” may be used to remove the sealingportion 14. However, the disclosure is not limited to use of a grinder.

As the first area A1 is partially removed, a thickness of the first areaA1 may be different from that of the second area A2.

The first area A1 of the sealing portion 14 may be removed until theinternal space of the shielding case 15 a is exposed to the outside. Thefirst component 1 a may be exposed to the outside.

Once the sealing portion 14 is removed, the shielding case 15 a may bechanged to a shielding wall 15 having a shape of a pipe or a ring.

The overall first area A1 may be partially removed. Thus, not only thesealing portion 14 disposed on an upper portion of the shielding case 15a, but also the sealing portions 14 a (in FIG. 2) disposed on both sidesof the shielding case 15 a may be partially removed. A stepped portionmay be formed between the sealing portion 14 a in the first area A1 andthe sealing portion 14 in the second area A2.

Since a height of the sealing portion 14 a in the first area A1 may belower than a height of the sealing portion 14 in the second area A2, anelectronic component may not be mounted in the sealing portion 14 a inthe first area A1, or only electronic components having a mountingheight lower than a mounting height of the shielding wall 15 may bemounted in the first area A1.

In the electronic device module manufactured through the processes asabove, a shielding wall may be disposed between the first component andthe second component, and thus, electromagnetic wave interferenceoccurring between the first component and the second component may beprevented.

As the shielding wall is formed between the first component and thesecond component using the shielding case, the shielding wall may beeasily mounted and manufactured.

When manufacturing the sealing portion, the shielding wall may perform afunction of shielding a flow of the sealing portion. Thus, a gap betweenthe sealing portion and the first component may be significantlyreduced.

Considering the case in which the sealing portion is only formed in thesecond component using a mold, not using the shielding case 15 a, a moldframe may need to be disposed between the first component and the secondcomponent. Thus, the first component and the second component may needto be spaced apart from each other by a distance equal to or greaterthan a thickness of the molding frame.

However, in the case in which the shielding wall is formed using ashielding case, it may not be necessary to dispose a mold frame betweenthe first component and the second component. Accordingly, a distancebetween the first component and the second component may besignificantly reduced, and an overall size of the electronic devicemodule may be significantly reduced as well.

The electronic device module according to the disclosure is not limitedto the aforementioned configurations, but various modifications thereofmay be possible.

FIGS. 7 to 9 are top views of an electronic device module according toan example.

In the electronic device module illustrated in FIGS. 7 and 8, ashielding wall 15 may include at least two shielding walls connected toeach other, and at least one of the shielding walls may be disposedbetween the first component 1 a and the second component 1 b.

Referring to FIG. 7, the electronic device module may be configuredsimilarly to the electronic device module in the aforementionedexamples, and the shielding wall 15 may be formed in a form of “

” (or “C”) with one surface being removed, and not being formed in asquare ring. Three walls connected to one another may be included, andone of the three walls may be disposed between the first component 1 aand the second component 1 b.

The electronic device module may be manufactured by removing one of fourshielding walls 15 of the shielding case 15 a by the process of dicingafter the shielding case 15 a (in FIG. 4) has been mounted on thesubstrate 11.

The ground electrode 19 may be bonded to an overall area of theshielding wall 15 in FIG. 7.

Referring to FIG. 8, the shielding wall 15 may not be formed to have ashape of a square ring, but may be formed to have an “L” shape with twosurfaces being removed. Two walls connected to each other may beincluded, and one of the walls may be disposed between the firstcomponent 1 a and the second component 1 b.

The electronic device module may be manufactured by removing twoshielding walls 15 among four shielding walls 15 of the shielding case15 a by the process of dicing after the shielding case 15 a has beenmounted on the substrate 11.

The ground electrode 19 may be connected to an overall area of theshielding wall 15 in FIG. 8.

Referring to FIG. 9, the shielding wall 15 may be formed to have a shapeof “I” with three surfaces being removed, and not in a shape of a squarering. The shielding wall 15 may be disposed to cross the substrate 11.

The electronic device module may be manufactured by removing threeshielding walls 15 among four shielding walls 15 of the shielding case15 by the process of dicing after the shielding case 15 a has beenmounted on the substrate 11.

The configurations illustrated in FIGS. 7 to 9 may be formed by, afterdisposing one to three surfaces of the shielding case 15 a in a dummyarea on a substrate strip, removing a surface formed in the dummy area,along with the dummy area on the substrate, in the process ofcollectively manufacturing a plurality of electronic device modules onthe strip-shaped substrate.

FIG. 10 is a cross-sectional view of an electronic device moduleaccording to an example.

Referring to FIG. 10, a shielding layer 17 may be disposed along asurface of a sealing portion 14 disposed in a second area A2.

The shielding layer 17 may be formed on a surface of the sealing portion14, and may block electromagnetic waves flowing into the secondcomponent 1 b from the outside or leaking from the second component 1 bto the outside. The shielding layer 17 may be formed of a conductivematerial, and electrically connected to a ground electrode 19 on thesubstrate 11.

To electrically connect the shielding layer 17 with the ground electrode19 on the substrate 11, at least a portion of the ground electrode 19may be exposed to the outside. The configuration may be achieved bylimiting a position and a size of the sealing portion 14, or bypartially removing the sealing portion 14 in the process ofmanufacturing the sealing portion 14 to allow the ground electrode 19 tobe partially exposed.

The ground electrode 19 may be configured to be exposed to a sidesurface of the substrate 11, and the shielding wall 17 may be extendedup to the side surface of the substrate 11 so that the ground electrode19 is able to be in contact with the shielding layer 17 on the sidesurface of the substrate 11, or other various modifications may bepossible.

The shielding layer 17 may be formed by coating an external surface ofthe sealing portion 14 with a resin material including a conductivepowder, or by forming a metal thin film. In the case of forming a metalthin film, various methods, such as a sputtering method, a vapordeposition method, an electroplating process, an electroless platingprocess, and the like, may be used.

For example, the shielding layer 17 may be a metal thin film formed onan external surface of the sealing portion 14 by a spray coating method.By the spray coating method, an evenly coated film may be formed, andcosts, in terms of infrastructure investment, may be relatively lowerthan other processes. However, the disclosure is not limited to such amethod or process. The metal thin film may also be formed using asputtering method.

The shielding layer 17 may be electrically connected to the shieldingwall 15. The shielding layer 17 may be bonded to an upper end of theshielding wall 15. Both the shielding layer 17 and the shielding wall 15may be formed of a conductive material (e.g., Cu, Ag, Au, Ni, Pt, or Pd,or alloys thereof), but may also be formed of different materials, asthe shielding layer 17 and the shielding wall 15 are formed throughdifferent processes. However, the shielding layer 17 and the shieldingwall 15 may be formed of the same material.

An antenna 20 may be disposed on the substrate 11. The antenna 20 may bedisposed in a position corresponding to a first area A1 and be betweentwo surfaces of the substrate 11. In the case in which the antenna 20 isdisposed in the second area A2, a wireless signal transmitted andreceived via the antenna 20 may be shielded by the shielding layer 17.Thus, the antenna 20 may be disposed only in the first area A1 in whichthe shielding layer 17 is not present.

In the case in which the antenna 20 is configured to radiate a wirelesssignal to a lower portion of the substrate 11, the antenna 20 may bedisposed in the second area A2.

For example, in the case of disposing a dipole antenna radiating awireless signal in a direction parallel the substrate 11, it may befavorable to dispose the antenna in the first area A1. However, in thecase of disposing a patch antenna radiating a wireless signal in a lowerportion direction among directions perpendicular to the substrate 11, itmay be possible to dispose the antenna in the second area A2.

The antenna 20 may be formed using a circuit pattern formed on thesubstrate 11. However, the antenna is not limited to such aconfiguration. An individually manufactured antenna component may bemounted on the second surface of the substrate 11 and used, or othervarious modifications may be possible.

A method of manufacturing an electronic device module will be describedbelow.

FIGS. 11 to 13 are views illustrating a method of manufacturing theelectronic device module in FIG. 10. In the processes of the method ofmanufacturing an electronic device module, a sealing portion 14 in afirst area A1 may be removed in steps.

The method of manufacturing an electronic device module may be performedas in the aforementioned examples with respect to the configurations inFIGS. 1 to 5.

Once the sealing portion 14 is formed, as illustrated in FIG. 5, aprimary removing process in which a shielding case 15 a disposed betweena first component 1 a and a second component 1 b is exposed may beundertaken, as illustrated in FIG. 11. Only a portion of the sealingportion 14, the portion disposed on an upper portion of a shielding walldisposed between the first component 1 a and the second component 1 b,may be removed.

The sealing portion 14 may be removed using a blade (not illustrated) ora laser used to cut or dice a module, and only a portion of theshielding case 15 a, the portion disposed between the first component 1a and the second component 1 b, may be exposed.

The sealing portion 14 removed in this process may be removed in a rangeof a width equal or similar to a width of a shielding wall 15 (in FIG.10), and once the sealing portion 14 is removed, an upper portion of theshielding wall 15 may be formed as an empty space (S).

As illustrated in FIG. 12, a shielding layer 17 may be formed. Theshielding layer 17 may be formed by coating an external surface of thesealing portion 14 with a resin material including a conductive powder,or by forming a metal thin film. In the case of forming a metal thinfilm, various methods, such as a sputtering method, a vapor depositionmethod, an electroplating process, an electroless plating process, andthe like, may be used.

The shielding layer 17 may be applied to the empty space S in thesealing portion 14, and may be connected to the shielding wall 15.

A secondary removing process in which the sealing portion 14 ispartially removed may be undertaken as illustrated in FIG. 13. Theremoved portion in this process may be the first area A1 (in FIG. 1) inwhich the shielding case 15 a is disposed, while the second area A2 (inFIG. 2) in which the second component 1 b is disposed may not beremoved. The shielding layer 17 formed on an upper portion of theshielding wall 15 may not be removed.

The shielding layer 17 and the shielding wall 15 may be indirectlyconnected to each other through the ground electrode 19 on the substrate11, the shielding layer 17 may not be directly connected to theshielding wall 15, or other various modifications may be possible.

FIG. 14 is a cross-sectional view of an electronic device moduleaccording to an example.

Referring to FIG. 14, a height of a portion 151 (hereinafter, referredto as a first shielding wall 151) of a shielding wall 15 sealing a firstcomponent 1 a, the portion disposed between a first component 1 a and asecond component 1 b, may be configured to be higher than a height ofthe other portion of the shielding wall 15.

A height of the first shielding wall 151 may be configured to be equalto a height of a sealing portion 14 disposed in the first area A1. Theshielding layer 17 may be connected to the first shielding wall 151 onthe same upper surface of the sealing portion 14.

The sealing portion may be removed in steps.

FIGS. 15 to 17 are views illustrating a method of manufacturing theelectronic device module in FIG. 14.

From the state in FIG. 5, a primary removing process in which an overallupper surface of a sealing portion 14 is removed to be planar using agrinder “G” until a shielding case 15 a is exposed may be undertaken, asillustrated in FIG. 15. A first component 1 a may not be exposed to theoutside.

As illustrated in FIG. 16, a process of connecting the shielding layer17 with the exposed shielding case by forming the shielding layer 17 ona surface of the sealing portion 14 may be undertaken.

As illustrated in FIG. 17, a secondary removing process in which theshielding case 15 a and the sealing portion 14 are partially removed toallow the first component 1 a in the first area A1 to be exposed to theoutside may be undertaken. The shielding wall 15 connected to theshielding layer 17 may not be removed.

The shielding layer 17 and the shielding wall 15 may be indirectlyconnected to each other through the ground electrode 19 on the substrate11, the shielding layer 17 may not be directly connected to theshielding wall 15, or other various modifications may be possible.

FIG. 18 is a top view of an electronic device module according to anexample. FIG. 19 is a cross-sectional view taken along line I-I′ in FIG.18.

Referring to FIG. 18, the electronic device module may include anantenna 20. An area of the electronic device module may be divided intoa first area A1 in which a first component 1 a is disposed, a secondarea A2 in which a shielding layer 17 is disposed, and a third area A3in which the antenna 20 is disposed.

A sealing portion 14 may be divided as a first sealing portion 141disposed in the first area A1, a second sealing portion 142 disposed inthe second area A2, and a third sealing portion 143 disposed in thethird area A3.

The first sealing portion 141 may be disposed on the outside of theshielding layer 17, and at least a portion of the first sealing portion141 may be connected to the shielding wall 15. The first sealing portion141 may be a sealing portion of which a portion is removed along withthe shielding wall 15 in the process of partially removing the shieldingwall 15. A thickness of the first sealing portion 141 may be lower thana thickness of the second sealing portion 142. For example, a thickness(or a height) of the first sealing portion 141 may be configured to beequal to a height of the shielding wall 15.

The second sealing portion 142 may be disposed in the shielding layer17. The second sealing portion 142 may have the second components 1 bembedded therein.

The third sealing portion 143 may be disposed on the outside of theshielding layer 17, similarly to the first sealing portion 141, and maynot have an electronic device or component embedded therein, and aconductive material may not be applied to a surface of the third sealingportion 143.

A thickness of the third sealing portion 143 may be configured to bedifferent from a thickness of the second sealing portion 142. Forexample, the third sealing portion 141 may have a thickness lower than athickness of the first sealing portion 141 or a thickness of the secondsealing portion 142. However, the disclosure is not limited to such aconfiguration.

The third sealing portion 143 may be disposed along an edge of thesubstrate 11. The third sealing portion 143 may be disposed along anedge of the substrate 11 and be formed to have a shape of a square.However, the disclosure is not limited to such a configuration.

The antenna 20 may be disposed on a second surface of the substrate 11or inside the substrate 11. The antenna 20 may be disposed in a positionopposing the third sealing portion 143 and between two surfaces of thesubstrate 11.

The notion that the antenna 20 is disposed to oppose or face the thirdsealing portion 143 may indicate that, when the antenna 20 is disposedon the first surface of the substrate 11, the antenna 20 may overlapwith the third sealing portion 143.

In the case in which the antenna 20 is disposed in an area opposing thefirst sealing portion 141 or the second sealing portion 142, a wirelesssignal transmitted and received via the antenna 20 may be shielded bythe shielding wall 15 or the shielding layer 17. The antenna 20 may onlybe disposed on a lower portion of the third sealing portion 143 in whichthe shielding wall 15 or the shielding layer 17 is not present.

However, the disclosure is not limited to such a configuration. In thecase in which the antenna 20 is configured to radiate a wireless signalto a lower portion of the substrate 11, the antenna may be disposed on alower portion of the first sealing portion 141 or the second sealingportion 142.

For example, in the case in which a dipole antenna radiating a wirelesssignal in a direction parallel the substrate 11 is disposed, it may befavorable to dispose the antenna 20 in the area (A3) opposing the thirdsealing portion 143. However, in the case of disposing a patch antennaradiating a wireless signal in a lower portion direction amongdirections perpendicular to the substrate 11, it may be possible todispose the antenna 20 in the areas A1 and A2 opposing the first sealingportion 141 and the second sealing portion 142.

The antenna 20 may be formed using a circuit pattern formed on thesubstrate 11. However, the antenna is not limited to such aconfiguration. For example, it may be possible to mount an individuallymanufactured antenna component on the second surface of the substrate11, or other various modifications may be possible.

The shielding layer 17 disposed between the second sealing portion 142or the third sealing portion 143 may be electrically connected to theground electrode 19 on the substrate 11.

In the case of the method of manufacturing an electronic device module,after the processes in FIG. 11, a process of allowing the groundelectrode 19 to be exposed to the outside of the sealing portion 14 byremoving the sealing portion 14 in a form of a slit along a boundarybetween the second sealing portion 142 or the third sealing portion 143,and a process of forming the shielding layer 17 on a surface of thesecond sealing portion 142 and inside the slit may be undertakensequentially. Thereafter, the sealing portion 14 in the third area A3may be removed by reducing a thickness of the sealing portion 14 using agrinder, and the third sealing portion 143 may be manufacturedaccordingly.

In the electronic device module, an antenna may be disposed in an areain which the shielding layer 17 is not disposed, and thus, electroniccomponents may be protected while maintaining a radiation performance ofthe antenna.

In the electronic device module, a shielding wall may be disposedbetween a first component and a second component, and accordingly,electromagnetic wave interference between the first component and thesecond component may be prevented.

As the shielding wall is formed between the first component and thesecond component using a shielding case, it may be easy to mount andmanufacture the shielding wall.

When manufacturing a sealing portion, the shielding wall may perform afunction of shielding a flow of the sealing portion as well, and thus, agap between the sealing portion and the first component may besignificantly reduced.

While this disclosure includes specific examples, it will be apparentafter an understanding of the disclosure of this application thatvarious changes in form and details may be made in these exampleswithout departing from the spirit and scope of the claims and theirequivalents. The examples described herein are to be considered in adescriptive sense only, and not for purposes of limitation. Descriptionsof features or aspects in each example are to be considered as beingapplicable to similar features or aspects in other examples. Suitableresults may be achieved if the described techniques are performed in adifferent order, and/or if components in a described system,architecture, device, or circuit are combined in a different manner,and/or replaced or supplemented by other components or theirequivalents. Therefore, the scope of the disclosure is defined not bythe detailed description, but by the claims and their equivalents, andall variations within the scope of the claims and their equivalents areto be construed as being included in the disclosure.

What is claimed is:
 1. An electronic device module comprising: asubstrate; a sealing portion disposed on a first surface of thesubstrate; a first component disposed outside of the sealing portion onthe first surface of the substrate; a second component disposed on thefirst surface of the substrate and embedded in the sealing portion; anda shielding structure comprising a shielding wall disposed between thefirst component and the second component, and a shielding layer disposedalong a surface of the sealing portion and the shielding wall, whereinthe shielding structure comprises an open-ended structure around thefirst component and a closed-ended structure around the secondcomponent.
 2. The electronic device module of claim 1, wherein theshielding wall comprises three walls.
 3. The electronic device module ofclaim 1, wherein the shielding wall comprises two walls, and the twowalls meet at a corner comprising a radius.
 4. The electronic devicemodule of claim 1, wherein the shielding wall and the first componentare configured to have an empty space therebetween.
 5. The electronicdevice module of claim 1, wherein the sealing portion is disposedbetween the shielding wall and the second component.
 6. The electronicdevice module of claim 1, wherein the shielding layer is extended to aside surface of the substrate, and wherein the substrate comprises aground electrode, and the ground electrode is exposed to the sidesurface of the substrate and is in contact with the shielding layer atthe side surface of the substrate.
 7. The electronic device module ofclaim 1, wherein the substrate comprises a ground electrode, and theshielding wall is bonded to the ground electrode.
 8. The electronicdevice module of claim 7, further comprising a dipole antenna disposedon or in a portion of the substrate that is outside an overlap with theshielding layer.
 9. The electronic device module of claim 7, furthercomprising a patch antenna disposed on or in a portion of the substratethat overlaps the shielding layer.
 10. The electronic device module ofclaim 1, wherein the sealing portion comprises a first sealing portionoutside of the shielding layer, and a second sealing portion within theshielding layer, and wherein the first sealing portion is disposedoutside of a region in which the second component is disposed.
 11. Theelectronic device module of claim 1, wherein the substrate comprises aground electrode, and the shielding layer is electrically connected tothe ground electrode.
 12. The electronic device module of claim 11,wherein the shielding layer is connected to an upper end of theshielding wall.
 13. The electronic device module of claim 11, whereinthe sealing portion comprises a first sealing portion without theshielding layer, and a second sealing portion provided with theshielding layer and having a thickness, with respect to the firstsurface of the substrate, that is the same as a thickness of the firstsealing portion, and further comprising an antenna disposed on or in aportion of the substrate that overlaps the first sealing portion. 14.The electronic device module of claim 13, wherein the shielding layer isextended to the first surface of the substrate between the first sealingportion and the second sealing portion.
 15. An apparatus comprising: asubstrate, a sealing portion disposed on the first surface of thesubstrate, a first component disposed on the first surface of thesubstrate, a second component disposed on the first surface of thesubstrate and embedded in the sealing portion, a shielding structurecomprising a shielding wall disposed between the first component and thesecond component, and a shielding layer disposed along a surface of thesealing portion and the shielding wall, wherein the shielding structurecomprises an open-ended structure around the first component and aclosed-ended structure around the second component; and an antennadisposed on a second surface of the substrate opposite the first surfaceor inside the substrate, wherein the antenna is disposed at a positionthat overlaps one or more of the first component and the secondcomponent.
 16. The apparatus of claim 15, wherein the shielding wall andthe first component are configured to have an empty space therebetween.17. The apparatus of claim 15, wherein the substrate comprises a groundelectrode, and the shielding layer is electrically connected to theground electrode.
 18. The apparatus of claim 15, wherein a first wall ofthe shielding wall has a height above the first surface of the substratethat is substantially equal to a height of the sealing portion.
 19. Theapparatus of claim 18, wherein a second wall of the shielding wall has aheight above the first surface of the substrate that is less than theheight of the sealing portion.
 20. The apparatus of claim 15, whereinthe antenna comprises one or more of a dipole antenna and a patchantenna and is disposed at a position that overlaps the first component.21. The apparatus of claim 15, wherein the antenna comprises a patchantenna and is disposed at a position that overlaps the secondcomponent.
 22. An electronic device module comprising: a substrate; asealing portion disposed on a first surface of the substrate; a firstcomponent disposed outside of the sealing portion on the first surfaceof the substrate; a second component disposed on the first surface ofthe substrate and embedded in the sealing portion; a shielding walldisposed between the first component and the second component; ashielding layer disposed along a surface of the sealing portion; whereinthe sealing portion comprises a first sealing portion without theshielding layer, and a second sealing portion provided with theshielding layer and having a thickness, with respect to the firstsurface of the substrate, that is substantially the same as a thicknessof the first sealing portion, and further comprising a first antennadisposed on or in a portion of the substrate that overlaps the firstsealing portion.
 23. The electronic device module of claim 22, whereinthe first sealing portion is disposed along a side of the substrate. 24.The electronic device module of claim 22, wherein the first antennacomprises a dipole antenna.
 25. The electronic device module of claim22, further comprising a second antenna disposed on a second surface ofthe substrate opposite the first surface or inside the substrate,wherein the antenna is disposed at a position that overlaps one or moreof the first component and the second component.
 26. The electronicdevice module of claim 25, wherein the second antenna comprises one ormore of a dipole antenna and a patch antenna and is disposed at aposition that overlaps the first component.
 27. The electronic devicemodule of claim 25, wherein the second antenna comprises a patch antennaand is disposed at a position that overlaps the second component. 28.The electronic device module of claim 22, wherein the substratecomprises a ground electrode extending along the entire shape of theshielding wall, and the shielding wall is bonded to the groundelectrode.
 29. The electronic device module of claim 28, furthercomprising an insulating protective layer stacked on top of the groundelectrode and comprising an opening to expose the ground electrode. 30.The electronic device module of claim 22, further comprising an antennawiring disposed on a second surface of the substrate opposite the firstsurface or inside the substrate.
 31. The electronic device module ofclaim 22, wherein the first component has a height above the firstsurface of the substrate that is less than or equal to a height of theshielding wall.
 32. The electronic device module of claim 22, whereinthe substrate comprises a ground electrode, and the shielding layerextends through the sealing portion to be electrically connected to theground electrode.
 33. The electronic device module of claim 22, whereinthe shielding layer is disposed along a surface of the shielding wall.